Configure with multi link wafer transfer robot

Bernoulli arm for thinner wafer handling

Wafer position & warpage intelligent mapping

Fiber sensor for wafer alignment

Contact chuck to handle various wafer 

Wafer cassette loading & unloading (Box Optional)

Standard industrial PC control with 17’touch panel LCD

Built-in Ionizers for ESD protection

Non-UV & UV tape capability

Wafer Type

Si , GaAs Single Flat, Double Flat or V-Notch

Tape Type

Blue Tape or UV Tape

Frame Type

6” DISCO or K&S, 8” DISCO or K&S; or Customer Specified

Mounting Theory

Vacuum Mounting or roller mounting

Wafer 

Place Accuracy

X-Y: +/- 0.5 mm   : +/- 0.5°

Input & Output

Dual Input Wafer Cassette / Single Input Wafer Box (Optional)

Dual Output Frame Cassette  

Customer Specified (Sample Supply)

ESD Control

Ion Fan

Wafer Transfer

Horizontal Multi-link Robot with Bernoulli Endeffector

Wafer Position & Warpage Intelligent Mapping in Cassette

Wafer Alignment

Fiber Sensor for Wafer Alignment

Control Unit

Standard Industrial PC with 17” Touch Panel LCD / Windows   O/S

Air Supplier

60 PSI CDA , 2.5 CFM

Machine Cover

White plastic plating cover

Dimensions

1136mm(W) x 1437mm(D) x 1747mm(H)

Net Weight

400kg

ADW-08

半自动晶圆撕膜机（减薄后）

AMS-12

半自动贴膜机（基板切割）

AMW-08 AT

半自动晶圆贴膜机（预切割膜）

AMW-12

半自动晶圆贴膜机（切割膜）

ATW-08

半自动晶圆贴膜机（减薄前）

ATW- 12

半自动晶圆贴膜机（减薄前）